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document no. s13894ej1v0ds00 (1st edition) date published february 2001 n cp(k) printed in japan quad pch high-side switch for usb data sheet mos integrated circuit the information in this document is subject to change without notice. before using this document, please confirm that this is the latest version. not all devices/types available in every country. please check with local nec representative for availability and additional information. ? 2001 description the pd16874 is a power switch ic with an overcurrent limiter that is used for the power bus of a universal serial bus (usb). this product has pch power mosfet circuits, each of which has a low-on resistance (100 m ? typ.), in its switching block. in addition, the ic is also equipped with an overcurrent detector that is essential for a host/hub controller conforming to the usb standard, so that the ic can report an overcurrent to the controller. moreover, a thermal shutdown circuit and an undervoltage lockout circuit are also provided as the protection circuits of the ic. this product has four channels of power switches, control input pins, and flag output pins to simultaneously control four usb ports with a single ic. features four p-ch power mosfet circuits overcurrent detector that outputs active-low control signal from detection report pin overcurrent limiter to prevent system voltage drop thermal shutdown circuit undervoltage lockout circuit each of four circuits can be turned on and off independently of the others by a control pin. (ctl input: active low) 16-pin sop package ordering information part number package pd16874gs 16-pin sop (7.62 mm (300))
data sheet s13894ej1v0ds 2 pd16874 block diagram notes on correct use ? no internal resistor is connected to input pins ctl1 (pin 4), ctl2 (pin 13), ctl3 (pin 5), and ctl4 (pin 12). when using the pd16874, therefore, be sure to set the voltage level of these input pins to ?h? or ?l?. ? keep the in pins (pins 1 and 8) at the same potential. ? supply a voltage lower than that supplied to the in pins (pins 1and 8) to v ddc (pin 9). ? flg1 (pin 3), flg2 (pin 14), flg3 (pin 6), and flg4 (pin 11) are internally pulled up to v ddc (usb controller supply voltage) (resistance: approx. 400 k ? ). therefore, no external pull-up resistor has to be connected to these pins. 1 in (input) 2 out1 (output 1) 3 flg1 (flag output 1) 4 ctl1 (control input 1) 5 ctl3 (control input 3) 6 flg3 (flag output 3) 7 8 out3 (output 3) out4 (output 4) in (input) 16 10 flg4 (flag output 4) ctl4 (control input 4) ctl2 (control input 2) flg2 (flag output 2) out2 (output 2) 11 12 13 14 15 gnd 9 v ddc (usb controller power supply) reference voltage overcurrent detection thermal shutdown circuit undervoltage lockout circuit to v ddc pin to v ddc pin gate control reference voltage overcurrent detection gate control gate control reference voltage overcurrent detection to v ddc pin to v ddc pin overcurrent detection gate control reference voltage
data sheet s13894ej1v0ds 3 pd16874 pin configuration (top view) pin description pin no. pin name pin function 4/5/12/13 ctl1/ctl2/ctl3/ctl4 control input (see the truth table below). ttl input 3/6/11/14 flg1/flg2/flg3/flg4 detection flag (output): active-low, nch open-drain 16 gnd ground 1/8 in power input: source of mosfet for output. power supply to internal circuitry of ic 9v ddc usb controller power supply. each flg output is connected via internal resistor. 2/7/10/15 out1/out2/out3/out4 switch output: drain of mosfet for output. usually, connected to load. truth table (h: high level, l: low level, on: output on, off: output off, x: h or l) ctln (in) flgn (out) outn (out) operation mode l h on outn on h h off outn off h (all) h (all) off (all) standby mode l l on outn overcurrent detection x l (all) off (all) thermal shutdown circuit operation x l (all) off (all) undervoltage lockout circuit operation in out1 flg1 ctl1 ctl3 flg3 out3 in gnd out2 flg2 ctl2 ctl4 flg4 out4 v ddc 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 16-pin sop
data sheet s13894ej1v0ds 4 pd16874 absolute maximum ratings (unless otherwise specified, t a = 25 c) parameter symbol conditions ratings unit input voltage v in ? 0.3 to +6 v flag voltage v flg ? 0.3 to +6 v flag current i flg 50 ma output voltage v out v in +0.3 v dc +0.5 (v in = v ctl = 5 v) ? 0.1 (v in = 0 v, v out = 5 v) output current i out pulse width single 100 s pulse +3 a control input v ctl ? 0.3 to +6 v total power dissipation note 1 p d 900 mw operating temperature range t a ? 40 to +85 c junction temperature note 2 t ch max +150 c storage temperature t stg ? 55 to +150 c notes 1. when mounted on a glass epoxy board measuring 90 mm 90 mm 1.6 mm thick 2. this product has an internal thermal shutdown circuit (operating temperature: 150 c or higher typ.) recommended operating range (unless otherwise specified, t a = 25 c) parameter symbol min. typ. max. unit input voltage v in +4 +5.5 v operating temperature range t a 0+70 c electrical specifications dc characteristics (unless otherwise specified, v in = +5 v, t a = +25 c) parameter symbol conditions min. typ. max. unit v ctl = v in (all ctl pins), out: open 15 a current consumption i dd v ctl = 0 v, out: open 150 a input voltage, low v il ctl pin 1.0 v input voltage, high v ih ctl pin 2.0 v v ctl = 0 v 0.01 1 a control input current i ctl v ctl = v in 0.01 1 a output mosfet on-resistance r on t a = 0 to +70 c, i out = 500 ma 100 140 m ? output leakage current i o leak 10 a overcurrent detector threshold i th t a = 0 to +70 c0.60.91.25a flag output resistance r on f i l = 10 ma 10 25 ? flag leakage current i o leak f v flag = 5 v 0.01 1 a v in : when rising 2.2 2.5 2.8 v v in : when falling 2.0 2.3 2.6 v undervoltage lockout circuit operating voltage v uvlo hysteresis width 0.05 0.25 v
data sheet s13894ej1v0ds 5 pd16874 electrical specifications ac characteristics (unless otherwise specified, v in = +5 v, t a = +25 c) parameter symbol conditions min. typ. max. unit output transition rise time (on) t rise r l = 10 ? per output 2.5 5 8 ms output transition fall time (off) t fall r l = 10 ? per output 10 s overcurrent detection delay time t over 20 s overcurrent detection output rise time t srise r l = 10 ? per output 2.5 5 8 ms minimum ctl high time t ctl ctl : l h l20 s points of measurement output transition rise time (on)/output transition fall time (off) overcurrent detection delay time/minimum ctl high time 5 v/3.3 v ctl 90% 90% 90% 10% v out t rise 0 v 0 v 5 v t fall ctl pin: h l/l h i th t over (internal time) t ctl i out v out flg ctl t srise 90% 10% 10%
data sheet s13894ej1v0ds 6 pd16874 description of functions 1. overcurrent detection this ic detects an overcurrent in a range of 0.6 to 1.25 a (0.9 a typ.) (the usb standard defines that an overcurrent is 0.5 a max.). when the ic detects an overcurrent, the flg pin goes low (active) and reports the result of detection to the control ic. at this time, the switch is kept on and the current limiter is activated. in this way, an overcurrent status that lasts for a long time can be prevented. by deasserted the ctl pin inactive by the control ic, the switch is turned off and the flg pin goes back high. therefore, the ctl signal must be deasserted inactive as soon as the controller ic has detected that the flg pin has gone low, to avoid overheating this ic. once the switch has been turned off, it turns back on again only when the ctl signal is asserted active while the flg pin is high. to prevent an inrush current being detected by mistake, a deadband time (overcurrent detection delay time) is set to elapse before the overcurrent detector is activated. the duration of this deadband time is 20 s typ. while the overcurrent limiter is activated, the power consumption of the device may abruptly increase. as a result, the junction temperature may also rise. make sure that the ctl signal is deasserted inactive and that the switch is turned off before the absolute maximum rating is exceeded. 2. undervoltage lockout circuit (uvlo) this circuit prevents malfunctioning of the switch due to fluctuation in supply voltage. when power is turned on (2.5 v or less typ.) or off (2.3 v or less typ.), the out and flg pins have the following status: out: off flg: ?l? (= 0 v) the above figure does not show the actual waveform. for the related characteristic waveform, refer to major characteristic curves. 5 v 2.3 v 2.5 v 5 v input voltage output voltage
data sheet s13894ej1v0ds 7 pd16874 3. behavior when power is turned on/off this ic performs a soft-start operation on power application. this is to prevent an overcurrent from flowing through the ic on power application while the high-capacity capacitor connected to the output pin is charged. power on: soft start (2.5 to 8 ms) power off: no control (10 s max.) the above figure does not show the actual waveform. for the related characteristic waveform, refer to major characteristic curves. 5 v v in 10 s max. 2.5 ms min. 8 ms max. v out 0 v 0 v 5 v
data sheet s13894ej1v0ds 8 pd16874 operation sequence power on/off note if the ctl signal is asserted active after power has been turned on, out executes the soft-start operation (output transition time: 8 ms max.). in addition, flg output is fixed to ?l? if the supply voltage is lower than the operating voltage of the undervoltage lockout circuit (uvlo) on power application. if all the ctl pins are inactive when power is supplied, the ic enters the standby status (idd = 5 a max.). when control signals are input 5 v gnd 5 v gnd 5 v gnd 5 v 5 v gnd overcurrent detection threshold in (input) out (output) i out flg (output) ctl (input) 5 v gnd 5 v gnd 5 v gnd gnd 5 v in (input) out (output) flg (output) ctl (input)
data sheet s13894ej1v0ds 9 pd16874 on detection of overcurrent if an overcurrent is detected after the overcurrent detection delay time of 20 s, the ic executes a slow-start operation again. if an overcurrent is detected while the ic is executing the slow-start operation again, it is assumed that the output is short-circuited and the flg pin goes low. when the ctl signal is deasserted inactive, out is turned off and flg goes high. if the ctl signal is asserted active, out is turned back on unless the undervoltage lockout circuit or thermal shutdown circuit is activated. 5 v in (input) flg (output) out (output) i out ctl (input) 5 v gnd 5 v 5 v gnd gnd overcurrent detection threshold slow start period when overcurrent (inrush current) is detected when overcurrent is detected (output is short-circuited)
data sheet s13894ej1v0ds 10 pd16874 when thermal shutdown circuit operates while the thermal shutdown circuit is activated, the output pins are in the off status. however, the ic does not enter the standby status even if all the clt pins are deasserted inactive at the same time. the thermal shutdown circuit is not activated even if the junction temperature exceeds 150 c typ. while the ic is in the standby mode (when all the ctl pins are inactive). test circuit 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 +5 v 10 ? 10 ? 10 ? 10 ? in out1 flg1 ctl1 ctl3 flg3 out3 in gnd out2 flg2 ctl2 ctl4 flg4 out4 v ddc 5 v gnd gnd 5 v gnd 5 v gnd 5 v standby status non-standby status in (input) out (output) t ch flg (output) ctl (input) thermal shutdown circuit operating temperature (rising) thermal shutdown circuit operating temperature (falling)
data sheet s13894ej1v0ds 11 pd16874 major characteristic curves (unless otherwise specified, t a = +25 c, v in = +5 v) 1200 900 600 300 0 140 120 100 80 60 40 20 0 total consumption p t (mw) total power dissipation p t vs. ambient temperature t a output on-resistance r on vs. ambient temperature t a output on-resistance r on vs. supply voltage v in current consumption i dd vs. ambient temperature t a current consumption i dd vs. supply voltage v in ambient temperature t a (?c) ambient temperature t a (?c) ? 40 0 ? 200 204060 80 40 80 120 200 160 output on-resistance r on (m ? ) 180 160 140 120 100 80 20 0 ambient temperature t a (?c) ? 200 204060 80 ambient temperature t a (?c) ? 20 20 060 40 80 current consumption ( a) 140 120 100 80 60 40 20 0 supply voltage (v) 3.5 4.0 4.5 5.0 5.5 6.0 6.5 output on-resistance r on (m ? ) 140 120 100 80 20 0 supply voltage (v) 3.5 4.0 4.5 5.0 5.5 6.0 6.5 3.5 4.0 4.5 5.0 5.5 6.0 6.5 current consumption ( a) current consumption (standby) i dd vs. ambient temperature t a 0.10 0.08 0.06 0.04 0.02 0.00 current consumption in standby mode ( a) supply voltage (v) current consumption (standby) i dd vs. supply voltage v in 0.10 0.08 0.06 0.04 0.02 0.00 current consumption in standby mode ( a)
data sheet s13894ej1v0ds 12 pd16874 major characteristic curves (unless otherwise specified, t a = +25 c, v in = +5 v) 1.80 1.70 1.60 1.50 1.40 1.30 input voltage v i vs. ambient temperature t a input voltage v i vs. supply voltage v in overcurrent threshold i th vs. ambient temperature t a overcurrent threshold i th vs. supply voltage v in ambient temperature t a ( ? c) ? ? c) ? ? c) ?
data sheet s13894ej1v0ds 13 pd16874 application circuit v bus d+ d ? ? ? ?
data sheet s13894ej1v0ds 14 pd16874 package drawing detail of lead end m 18 9 16 s s a b h k m l p j i g c e f n d item b c i 16-pin plastic sop (7.62 mm (300)) a d e f g h j p millimeters 1.27 (t.p.) 0.78 max. 5.6 + ? + ? + ?
data sheet s13894ej1v0ds 15 pd16874 recommended soldering conditions the pd16874 should be soldered and mounted under the following recommended conditions. for soldering methods and conditions other than those recommended, contact your nec sales representative. surface mount type for the details of the recommended soldering conditions, refer to the document semiconductor device mounting technology manual (c10535e ). pd16874gs soldering method soldering conditions recommended condition symbol infrared reflow package peak temperature: 235c, time: 30 sec. max. (at 210c or higher), count: two times, exposure limit: not limited note ir35-00-2 vps package peak temperature: 215c, time: 40 sec. max. (at 200c or higher), count: two times, exposure limit: not limited note vp15-00-2 wave soldering solder bath temperature: 260c max., time: 10 sec. max., count: once, exposure limit: not limited note ws60-00-1 partial heating pin temperature: 300c max., time: 3 sec. max., exposure limit: not limited note ? note after opening the dry pack, store it at 25c or less and 65% rh or less for the allowable storage period. cautions do not use different soldering methods together (except for partial heating). reference quality grades on nec semiconductor devices c11531e semiconductor device mounting technology manual c10535e nec semiconductor device reliability/quality control system c10983e semiconductor selection guide x10679x
data sheet s13894ej1v0ds 16 pd16874 [memo]
data sheet s13894ej1v0ds 17 pd16874 [memo]
data sheet s13894ej1v0ds 18 pd16874 notes for cmos devices 1 precaution against esd for semiconductors note: strong electric field, when exposed to a mos device, can cause destruction of the gate oxide and ultimately degrade the device operation. steps must be taken to stop generation of static electricity as much as possible, and quickly dissipate it once, when it has occurred. environmental control must be adequate. when it is dry, humidifier should be used. it is recommended to avoid using insulators that easily build static electricity. semiconductor devices must be stored and transported in an anti-static container, static shielding bag or conductive material. all test and measurement tools including work bench and floor should be grounded. the operator should be grounded using wrist strap. semiconductor devices must not be touched with bare hands. similar precautions need to be taken for pw boards with semiconductor devices on it. 2 handling of unused input pins for cmos note: no connection for cmos device inputs can be cause of malfunction. if no connection is provided to the input pins, it is possible that an internal input level may be generated due to noise, etc., hence causing malfunction. cmos devices behave differently than bipolar or nmos devices. input levels of cmos devices must be fixed high or low by using a pull-up or pull-down circuitry. each unused pin should be connected to v dd or gnd with a resistor, if it is considered to have a possibility of being an output pin. all handling related to the unused pins must be judged device by device and related specifications governing the devices. 3 status before initialization of mos devices note: power-on does not necessarily define initial status of mos device. production process of mos does not define the initial operation status of the device. immediately after the power source is turned on, the devices with reset function have not yet been initialized. hence, power-on does not guarantee out-pin levels, i/o settings or contents of registers. device is not initialized until the reset signal is received. reset operation must be executed immediately after power-on for devices having reset function.
data sheet s13894ej1v0ds 19 pd16874 regional information some information contained in this document may vary from country to country. before using any nec product in your application, piease contact the nec office in your country to obtain a list of authorized representatives and distributors. they will verify: ? ? ? ? ? ?
pd16874 m8e 00. 4 the information in this document is current as of december, 2000. the information is subject to change without notice. for actual design-in, refer to the latest publications of nec's data sheets or data books, etc., for the most up-to-date specifications of nec semiconductor products. not all products and/or types are available in every country. please check with an nec sales representative for availability and additional information. no part of this document may be copied or reproduced in any form or by any means without prior written consent of nec. nec assumes no responsibility for any errors that may appear in this document. nec does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of nec semiconductor products listed in this document or any other liability arising from the use of such products. no license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of nec or others. descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. the incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. nec assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. while nec endeavours to enhance the quality, reliability and safety of nec semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. to minimize risks of damage to property or injury (including death) to persons arising from defects in nec semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. nec semiconductor products are classified into the following three quality grades: "standard", "special" and "specific". the "specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. the recommended applications of a semiconductor product depend on its quality grade, as indicated below. customers must check the quality grade of each semiconductor product before using it in a particular application. "standard": computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "special": transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "specific": aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. the quality grade of nec semiconductor products is "standard" unless otherwise expressly specified in nec's data sheets or data books, etc. if customers wish to use nec semiconductor products in applications not intended by nec, they must contact an nec sales representative in advance to determine nec's willingness to support a given application. (note) (1) "nec" as used in this statement means nec corporation and also includes its majority-owned subsidiaries. (2) "nec semiconductor products" means any semiconductor product developed or manufactured by or for nec (as defined above). ? ? ? ? ? ?

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